Fourier manufactures thin, complex ceramic components through a repeatable thermoforming process, enabling semiconductor packaging, SWaP-C thermal management, and RF solutions.

The demonstrated thermoformed ceramic component encapsulates a Beagle Board Fire V PCB. ​​

​

Fourier's current ceramic thermoforming capabilities,​

• Ceramics are fully fired into flat plates pre-thermoforming

• Current size formable sizes range  between

  • 5 mm x 2 mm x 0.25 mm

  • 10 cm x 10 cm x (0.25 - 3 mm)

  • Size constraints are due to on-site equipment, not the process

• Thickness of plate ranges between 0.25 mm - 3 mm

• Tolerance of the thermoforming process is measured to be +/- 0.016 mm of the nominal dimension

• Resolution of forming process is currently 0.20 mm

• Production volume is currently 50 - 200 components per week depending on ceramic component footprint ​