Fourier is a Boston-based spinout company from Northeastern University. We are working to commercialize the platform technology of thermoformable ceramic matrix composites (CMC) for multifunctional packaging, device fabrication, and thermal management solutions in advanced electronics. The founding team invented a new CMC material and manufacturing process that can elastically deform fully-sintered, thin (0.1 mm - 3 mm) CMC sheets into complex, three-dimensional, end-use ceramic parts. Fourier has identified use cases for the Electrification Ecosystem for Sustainable Design and Materials, and geometrically complex Power Electronic devices.

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The solution to the problem - Currently 55% of all electronics are attributed to a lack of heat dissipation, and this problem spans industries  (aerospace, energy, automotive, etc.). This failure rate is one of the leading causes of 50 MMT of e-waste and 3000 MMT of related carbon emissions in 2023. Fourier's technology aims to provide a serious impact to reducing those GHG and waste contributions. Currently, Fourier's technology is capable of a 16.5% reduction (8.25 MMT e-waste and 495 MMT carbon emissions). However, as we advance we believe our technology is capable of a reduction of over 50%, a major impact to the reduction of these pollutants with our hardware solutions alone. Beyond GHG and e-waste, industry verticals such as low earth orbit (LEO) and long range space electronic devices are at least a decade behind the state-of-the art technology because of radiation and extreme environment conditions, and still require critical updates to sustain next generation space flight. Fourier's technology is a solution to this problem. Further, power electronics have limited thermal management options, Fourier provides strong dielectric material systems that are highly thermally conductive, and provide the potential to be a driving solution in the TIM 1.5 and TIM 2 verticals,and fabricating full electronic devices.