Fourier was founded in 2022 by Jason Hoffman-Bice, inventor of a new class of ceramics, thermoformable ceramics and the high temperature ceramic manufacturing process. The technology of thermoformable ceramic materials evolved from Jason's PhD research, and from the discovery of the thermoformable ceramic, Jason developed the high-temperature ceramic thermoforming process to control the formability of the ceramic material with accuracy and precision (resolution of minimal feature size 0.2 mm, tolerance from the nominal dimension +/-0.016 mm). Since Fourier's founding, the team has been growing and working towards commercializing of the thermoformable ceramic platform technology, solving critical challenges for size, weight, power, and cost (SWaP-C) constrained electronic systems. Specifically in challenging cases where strong dielectrics and highly thermally conductive materials solutions are required.
Traditionally, strong dielectric ceramic materials that are also highly thermally conductive are difficult and expensive to process into net-shaped components (machining, injection molding, and 3D printing). Further, when considering low-profile designs, there are few to no viable manufacturing processes that are cost effective due to production capabilities, expertise, and tooling expenses. Each ceramic manufacturing process has viability for specific part manufacturing. Fourier's thermoformable ceramic system is no different. Fourier's current manufacturing focus is where no other ceramic manufacturing process has an advantage, in thin (< 0.25 mm to > 3mm), thin-walled topographically complex geometries that enable component foot print length scales ranging from mm (semiconductor component packaging) to 10's of cm (electronic board or device enclosures for thermal management applications) to future development to the meter length scale (RF windows and structural solutions).
Currently 55% of all electronic failures are attributed to a lack of heat dissipation, and this problem spans industries (aerospace, energy, automotive, etc.). This failure rate is one of the leading causes of 50 MMT of discarded electronics in 2023. Every premature failure means replacement costs, downtime, and lost service life for the device operator. Fourier's thermoformable ceramics currently demonstrate a 16.5% reduction in thermally-driven failure rates, extending device operating life and lowering total cost of ownership. Our technical goal is to achieve a 50% reduction of this electronic failure mode, a major impact for device reliability, lifecycle costs, and materials efficiency across industries we serve.
The electronification economy is becoming a premiere growth market, from electric vehicles (ground and air), to evolving energy needs, to advanced communication network systems, innovation beyond our best materials, components, and devices is required. Today Fourier is working towards the commercialization of their novel solution of thermoformable ceramics to a solve problems in a large, but niche application space. Tomorrow, Fourier will drive innovation not only in ceramic materials and processing, but in substrates, devices, and sub-system electronics to realize their long-term broader impact vision.
